Electromagnetic, Electronics, Thermal and Electromechanical Simulation.

ANSYS electromagnetic field simulation helps you design innovative electrical and electronic products faster and more cost-effectively. In today’s world of high-performance electronics and advanced electrification systems, the effects of electromagnetic fields on circuits and systems cannot be ignored. ANSYS software can uniquely simulate electromagnetic performance across component, circuit and system design, and can evaluate temperature, vibration and other critical mechanical effects. This unmatched electromagnetic-centric design flow helps you achieve first-pass system design success for advanced communication systems, high-speed electronic devices, electromechanical components and power electronics systems.

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Wireless and RF

ANSYS high-frequency electromagnetics design software enables you to design, simulate and validate the performance of antennas and RF and microwave components. The integrated microwave circuit and system modeling capabilities have direct integration to our EM solvers delivering a platform for full-system verification of next-generation RF and microwave designs.

PCB and electronic packaging

The ANSYS Chip-Package-System (CPS) design flow delivers unparalleled simulation capacity and speed for power integrity, signal integrity and EMI analysis of high-speed electronic devices. Automated thermal analysis and integrated structural analysis capabilities complete the industry’s most comprehensive chip-aware and system-aware simulation solution across the chip-package-board.

Electromechanical and power electronics

ANSYS electromechanical and power electronics simulation software is ideal for applications which depend on the robust integration of motors, sensors, and actuators with electronics controls. ANSYS software simulates the interactions between these components, and the design flow incorporates thermal and mechanical analysis for evaluating cooling strategies and analyzing critical mechanical effects like noise-vibration-harshness (NVH).

Electronics Thermal Management

ANSYS electronics thermal management solutions leverage advanced solver technology with robust, automatic meshing to enable you to rapidly perform heat transfer and fluid flow simulation for convective and forced air cooling strategies. Our solutions help you design cooling strategies to avoid excessive temperatures that degrade the performance of IC packages, printed circuit boards (PCBs), data centers, power electronics and electric motors.

Design power cables used in subsea oil fields and other
high-power applications.


The Internet of Things, wearable electronics, 5G, unmanned aerial vehicles (UAV) and automotive radar are emerging applications that are driving extreme integration of RF and wireless communications. The ANSYS Antenna and Wireless System design flow delivers the simulation features you need to create reliable, optimized systems faster than your competition.

Automotive Radar

Analyze complex automotive radar driving scenarios using the powerful and accurate methods of ANSYS HFSS SBR+. Engineers can solve advanced automotive ADAS radar systems and understand the response from a complex automotive driving scenario. Features include SBR+ solution type, parametric antenna sources with far-field overlay and accelerated frequency sweeps.


ANSYS HFSS-SBR+ is a powerful, shooting and bouncing ray (SBR) electromagnetic field solver option for HFSS. HFSS SBR+ predicts performance of antennas mounted to electrically large platforms. Antenna designs created in HFSS can be linked to HFSS SBR+ and placed on an electrically large platform and rapidly solved. This powerful combination enables you to analyze installed performance and optimize antenna placement.


With a rapidly increasing number of wireless devices and a finite spectrum in which to operate, the likelihood of these communication systems interfering with each other and degrading the performance of neighboring systems becomes greater every day. The ANSYS RF Option now includes EMIT, the industry-leading software for predicting RF co-site and EMI interference of multiple radio transmitters and receivers.


As communication systems push the limits of component size, weight and performance, engineers must adopt new technologies and smarter workflows by leveraging EM field simulators linked to powerful harmonic balance and transient circuit simulation. ANSYS electromagnetic solutions break the cycle of repeated design iterations and physical prototyping. With ANSYS solutions, you can consistently achieve best-in-class design in a broad range of applications including passive RF/mW components, integrated multichip modules, advanced packaging and RF PCBs.


ANSYS provides a complete suite of engineering simulation tools to help identify signal integrity issues early in the design cycle for electronics IC packages, PCBs, connectors and other complex interconnects. ANSYS signal integrity analysis products predict EMI/EMC, signal integrity and power integrity issues — enabling your design team to optimize system performance before build and test.


ANSYS provides the world’s leading simulation solution for power delivery from chip to package, PCBs and chassis/casings. ANSYS simulation tools for multicountry-certified chip-level power sign-off, automated AC operating performance prediction and DC power loss and thermal mitigation ensure chip-package-system power integrity for performance, reliability, and cost.


Sensors, actuators, and transformers and other electromagnetic and electromechanical devices are key to the megatrend of electrification. ANSYS low frequency, electromagnetic field simulation software allows you to accurately calculate critical design parameters and automatically create precise system-level device models quickly and accurately.


ANSYS provides electronics cooling simulation products for chip, package and board thermal analysis as well as thermo-mechanical stress analysis. ANSYS simulation tools help you manage excessive heat that can otherwise lead to increasing leakage and electromigration failures of the chip, as well as analyze die package, PCB and interconnect thermal differential expansion to enhance reliability of the entire electronic system.


ANSYS delivers a comprehensive motor design methodology that will reduce design cost and optimize size, noise, efficiency and durability. The ANSYS motor design solution delivers robust electromagnetic, thermal and mechanical analyses, combined with power electronic circuit simulation and embedded software tools to analyze the complete motor-driven system.


Model the radar signatures of electrically very large targets and scenes with the powerful HFSS SBR+ solver. Engineers can easily perform fast radar cross section (RCS) calculations to detect objects such as aircrafts, vehicles and ships, as well as design these objects to minimize radar detection.

Electromagnetic Interference Compatibility

ANSYS electromagnetic and circuit technologies empower engineers to mitigate potential EMI issues early in the design cycle. Automated workflows in ANSYS Electronics Desktop leverage easy mechanical CAD (MCAD) and electrical CAD (ECAD) system assemblies to simulate complete electrical devices, increase their immunity and meet EMC standards using a single simulation platform.


As microprocessors gain speed and reliability, more electronic controls and electrical content are being applied to traditional mechanical and hydraulic processes. Power electronic and mechatronic systems are increasing operational efficiency and delivering advanced automation features through a blend of mechanical, electronics and embedded software components. Aircraft, automobiles, defense systems, machine tools, home appliances, toys and many other products are based on power electronic and mechatronic systems.


Radio frequency desensitization (RF desense) is a form of RF interference (RFI) that results in reduced performance, or “desensitization,” of wireless systems that are integrated into electronic devices. Combining ANSYS HFSS with EMIT, a capability within ANSYS RF Option, can identify and eliminate desense in wireless electronic products.


Flagship Products


A specialized tool for power integrity, signal integrity and EMI analysis of IC packages and PCBs. Solves power delivery systems and high-speed channels in electronic devices.

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A CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, power electronics.

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Q3D Extractor

A 2D and 3D EM field simulator to extract RLCG parameters from an interconnect. It’s a parasitic extraction tool to design electronic packaging and power electronic devices.

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A 3D EM field solver to design high-frequency and high-speed electronic components. Its FEM, IE, asymptotic and hybrid solvers address RF, microwave, IC, PCB and EMI problems.

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Electronics Enterprise

Premier software package for the engineer solving problems across the electronics design spectrum. All Ansys electronics technologies are included in this single user package.

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Electronics Pro 2D

Electronics Pro 2D is ideal for 2D low frequency electromagnetic analysis, 2D parameter extraction, RF system analysis for the prediction of radio frequency interference and circuit simulation with advanced RF functionality.

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Electronics design software that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages.

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A template-based design tool for fast multiphysics analyses of electric motors across the full torque-speed operating range to optimize their performance, efficiency and size.

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An EM field solver for electric machines, transformers, actuators and other electromechanical devices. It solves static, frequency-domain, and time-varying electric fields.

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