Design reliable semiconductor chips with production-proven solutions


The new era of semiconductors will enable transformational products for artificial intelligence (AI), 5G, automotive, networking, cloud and edge compute applications. Ubiquitous connectivity, low latency and faster data rates will enable billions of more smart devices. These devices will rely on advanced, low power FinFET designs and state-of-the-art 3D integrated circuit (IC) packaging technologies to deliver the required power, performance, area and reliability metrics.

Multiphysics analysis is critical for enabling these cutting-edge electronics systems to work reliably throughout their lifetime. Ansys empowers customers with multiphysics simulations to simultaneously solve power, thermal, variability, timing, electromagnetics and reliability challenges across the spectrum of chip, package and system to promote first-time silicon and system success. Ansys simulation and modeling tools offer you early power budgeting analysis for high-impact design decisions and foundry-certified accuracy needed for IC signoff.

System-aware IC power efficiency, power integrity and reliability

At the core of every electronics system is a chip that must meet multiple conflicting requirements, such as high performance, increased functionality, power efficiency, reliability and low cost. Ensuring the chip meets power efficiency, power integrity and reliability requirements as both a stand-alone component and within the electronics system calls for a system-aware chip design methodology. Ansys uniquely offers a suite of multiscale, multiphysics solutions to support a chip-package-system (CPS) design flow.

The Ansys semiconductor portfolio of power efficiency, power integrity and reliability solutions achieves ISO 26262 “Tool Confidence Level 1” (TCL1) certification. This certification enables automotive IC designers to meet rigorous safety requirements for ADAS and autonomous applications. Auto chip makers can leverage Ansys PowerArtist, Ansys Totem and Ansys RedHawk family of multiphysics simulations for all ISO 26262 safety-related development projects at any Automotive Safety Integrity Level.

Foundry certified accuracy

With the cost of designing and implementing a system-on-chip (SoC) ranging from $50 million to $200 million, first-time working silicon is a must. IC designers require the most accurate simulation solution and consider foundry certification as the ultimate proof of accuracy. Ansys semiconductor solutions have been certified by all leading foundries since 2006.

Production-proven solutions

Our software has enabled thousands of successful tape-outs across multiple technology nodes.

Design power cables used in subsea oil fields and other
high-power applications.


ANSYS RedHawk provides the world’s leading simulation solution for system-on-chip (SoC) power integrity analysis. ANSYS simulation tools enable you to model supply voltage variations with sign-off accuracy and reduce the overall power noise impact through the package and board.


Semiconductor intellectual property cores (IPs) are critical parts of any system-on-chip (SoC) design. ANSYS Totem offers a comprehensive co-simulation framework for analog, mixed-signal and custom circuit designs. Totem also provides a comprehensive full-chip solution for modeling and simulating noise injection, propagation and coupling through the on-die..


Vertically-stacked integrated circuits (3D-IC) have emerged as a leading solution for getting higher performance in a smaller form factor with lower power requirements. The ANSYS RedHawk 3D-IC platform enables you to simulate multiple stacked ICs that use 2.5D and 3D integration and to extract accurate package models during power and signal integrity simulations.


For Internet of Things and mobile technologies, which typically operate on batteries, ICs used that consistently require greater computing power in smaller chips, power consumption analysis of integrated circuits (ICs) is key to a successful design. ANSYS PowerArtist is a comprehensive register-transfer level (RTL) design-for-power platform enabling you to analyze, debug and improve power efficiency for digital ICs.


Next-generation automotive, mobile and high-performance computing applications demand the use of 7nm SoCs to deliver greater functionality and higher performance at much lower power. According to Gartner, when compared to 16nm/14nm technology, 7nm offers 35% speed improvement, 65% less power, and 3.3X density improvement.


High speed digital cores, analog circuits, radio frequency modules and I/O interfaces integrated on the same IC, noise propagation can reduce circuit efficiency and affect circuit operations. The ANSYS Canyon Substrate Extension platform models noise propagation from the core and substrate, enabling you to minimize noise and optimize your design before prototyping.


Automotive designs increasingly incorporate multitudes of electronics systems to provide safety, comfort, and better performance. As more of these systems are integrated and operate simultaneously, poor system design can increase temperature, electrical noise, and create magnetic interference. The ANSYS software platform ensures these systems are validated for system integrity.


Large system on chips (SoCs) using advanced FinFET technologies achieve higher performance and density in a smaller area. More chips in a smaller package, however, generate greater amounts of heat. ANSYS simulation and modeling tools give you the simulation and analysis accuracy you need to ensure top performance in even the most complex integrated systems.


Flagship Products


RedHawk is the standard for power integrity and reliability solutions. It accurately predicts chip power and noise using voltage drop simulation analysis for the entire power delivery network (PDN), from chip to package to board.

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Totem is a transistor-level power noise and reliability simulation platform for analog, mixed-signal and custom digital designs.

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PowerArtist is the industry-leading comprehensive register-transfer-level (RTL) design-for-power platform to analyze, debug and reduce power early in the RTL stage for maximizing power savings.

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RaptorX is a novel pre-LVS electromagnetic modeling software with limitless capacity of its engine in combination with highly accurate results and blazing fast modeling times.

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Exalto is a powerful post-LVS RLCk extraction software that enables IC design engineers to accurately predict electromagnetic coupling effects during the sign-off phase.

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Featured Products


ANSYS PathFinder helps you plan, verify and sign-off IP and full-chip SoC designs for integrity and robustness against electrostatic discharge (ESD).

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The next-generation SoC power integrity and reliability signoff platform - based on big data and elastic compute architecture - designed to enable sub-16nm design success.

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Path FX

SPICE accurate path-based timing tool to evaluate hundreds of thousands of timing paths in an SoC for delay and variance. It compliments existing STA signoff tools.

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Variance FX

Variation modeling tool for standard cells and custom macros. It creates both delay and constraint derates and .lib timing models for entire libraries in a matter of hours.

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Electromagnetic (EM) crosstalk identification software that enables IC designers to quickly and accurately uncover nets that are susceptible to EM crosstalk in their design.

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An inductive device compiler and modeling tool for IC designers. It integrates with leading EDA platforms and provides accurate SPICE models, silicon-verified up to 110 GHz.

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