Wireless communication systems are powering the smart products revolution.

New industry standards require innovative approaches to create higher-speed, higher-throughput communication systems design. Engineers designing these systems also face size, weight, power, and time-to-market constraints.

With Ansys simulation software, engineers can take a multiphysics approach to address these challenges. They can perform traditionally sequential tasks in parallel and study the interaction between components and subsystems. R&D teams can use coupled multiphysics software to analyze signal integrity, power integrity, thermal performance and EMI/EMC.

This approach increases insight driven innovation and helps achieve system design goals faster while reducing the number of physical tests, late stage failures, as well as development time and cost.

Wireless communication systems are powering the smart products revolution. Today’s smartphones and networked devices support multiple wireless technologies, such as Bluetooth, Wi-Fi and LTE. This level of integration requires engineers TO take steps to mitigate EMI/EMC issues as well as thermal issues.

RF and microwave system design engineers rely on ANSYS electromagnetic simulation software to conduct high-fidelity 3-D EM simulations, analyze geometric-scale variations, perform thermomechanical stress analysis and optimize antenna design. The integrated workflow enables you to rapidly conduct design trade-offs, resulting in improved range, reliability, and data throughout.

In the race to deliver low-cost, high-performance, power-efficient electronics and semiconductor products in a timely manner, engineers are adopting chip–package–system (CPS) design methodology that allows co-analysis and co-optimization across the entire system.

ANSYS products provide a comprehensive solution for 3-D chip design, including FinFET transistors, stacked-die IC and packages. The simulation-driven modeling, analysis and verification workflow enables you to optimize power delivery and timing networks, identify signal integrity and power integrity issues and mitigate EMI and thermal issues early in the design cycle.

Engineers often have to make trade-offs between power efficiency and high performance. For example, low power design is needed to ensure that smart phones have long battery life and electric motors run as peak efficiency. Without adequate multiphysics simulation, engineers often over-design their systems, leading to added costs and inefficiencies.

With Ansys simulation software, engineers can design power electronic systems, perform coupled thermal and electrical simulations to design for temperature uniformity, explore large design spaces to converge on the optimal solution, and use reduced order models to speed up complex analysis.

This approach improves energy efficiency and system performance while reducing field failure due to unexplored operating conditions.