About this Webinar

Being physical structures, PCBs and other electronic components are susceptible to failure due to excessive deformation/warpage (often from thermal loads), shock, vibration, drop, and other environmental conditions.  Structural integrity needs to be maintained to help ensure electronic devices perform their intended function.  Ansys has a wide-variety of solutions for quickly preparing and simulation high-fidelity FEA models that can be used to assess the mechanical performance of electronic systems.

In this webinar, we will discuss Mechanical Reliability Challenges encountered by engineers and how Ansys technology can help.

Speaker: Ivaylo Klecherov

Addressing Electronics Reliability Engineering Challenges Webinar Series

Engineers must address a wide-variety of design requirements when designing electronic systems.  These range from electrical (such as Signal and Power Integrity), thermal (such as the implementation of optimal cooling strategies), or mechanical (ability to withstand thermal cycling, shock, vibration, drop, etc.) considerations.  Further, products are expected to meet life requirements to ensure they meet their intended function for (at least) a specified amount of time.  Engineers also need to consider the effects of manufacturing, transportation, and product operation as a part of their design process.