About this Webinar

Maintaining thermal integrity is an essential part of designing best-in-class electronic systems.  Thermal simulations allow engineers to evaluate and optimize cooling strategies (for example forced convection approaches using fans vs. natural convection) and component designs (such as heat sinks).  Using Ansys tools, users can evaluate thermal performance from the chip/die level all the way up to the system/data center level.  Users can also consider downstream effects, such as thermal-mechanical effects such as PCB and package warpage and stress.

In this webinar, we will discuss Thermal Reliability Challenges encountered by engineers and how Ansys technology can help.

Speaker: Samir Sfarni, Neda Emami, Ajay Parihar

Addressing Electronics Reliability Engineering Challenges Webinar Series

Engineers must address a wide-variety of design requirements when designing electronic systems.  These range from electrical (such as Signal and Power Integrity), thermal (such as the implementation of optimal cooling strategies), or mechanical (ability to withstand thermal cycling, shock, vibration, drop, etc.) considerations.  Further, products are expected to meet life requirements to ensure they meet their intended function for (at least) a specified amount of time.  Engineers also need to consider the effects of manufacturing, transportation, and product operation as a part of their design process.